APA引文

Mohd. Salleh Ismail. (1993). Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices. University of California.

Chicago Style (17th ed.) Citation

Mohd. Salleh Ismail. Technology and Application of Aligned Wafer Bonding for Three Dimensional Microstructures and Microdevices. Davis, Calif: University of California, 1993.

MLA引文

Mohd. Salleh Ismail. Technology and Application of Aligned Wafer Bonding for Three Dimensional Microstructures and Microdevices. University of California, 1993.