Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices /

Technology and application of aligned wafer bonding for three dimensional microstructures and microdevices /

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书目详细资料
主要作者:	Mohd. Salleh Ismail
格式:	Thesis 图书
语言:	English
出版:	Davis, Calif: University of California, 1993.
主题:	Semiconductor wafers. Integrated circuits > Water > scale integration.
标签:	添加标签没有标签, 成为第一个标记此记录!

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