APA引文

Tan, C. W. (2002). A study of wire bonded Cu-A1 in microelectronics packaging. Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia.

Chicago Style (17th ed.) Citation

Tan, Chee Wei. A Study of Wire Bonded Cu-A1 in Microelectronics Packaging. Bangi: Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 2002.

MLA引文

Tan, Chee Wei. A Study of Wire Bonded Cu-A1 in Microelectronics Packaging. Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 2002.

警告：这些引文格式不一定是100％准确.