Kesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan /

Kesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan /

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Bibliographic Details
Main Author: Hoh, Huey Jiun
Format: Thesis Book
Language:Malay
Published: Bangi : Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, 2006
Subjects:
Universiti Kebangsaan Malaysia > Dissertations
Dissertations, Academic > Malaysia
Semiconductor wafers > Design and construction
Semiconductor
Integrated circuits
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Description
Physical Description:xvi, 122 p. : ill. ; 30 cm.
Bibliography:Rujukan : p. 114 - 122

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