Kesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan /
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Main Author: | |
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Format: | Thesis Book |
Language: | Malay |
Published: |
Bangi :
Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia,
2006
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005 | 20070803111100.0 | ||
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090 | |a TK7871.85 |b . H648 2006 3 | ||
100 | 1 | |a Hoh, Huey Jiun | |
245 | 1 | 0 | |a Kesan penipisan wafer terhadap keutuhan mekanikal wafer silikon dan proses pemotongan / |c Hoh Huey Jiun |
260 | |a Bangi : |b Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, |c 2006 | ||
300 | |a xvi, 122 p. : |b ill. ; |c 30 cm. | ||
502 | |a Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2006 | ||
504 | |a Rujukan : p. 114 - 122 | ||
610 | 2 | 0 | |a Universiti Kebangsaan Malaysia |x Dissertations |
650 | 0 | |a Dissertations, Academic |z Malaysia | |
650 | 0 | |a Semiconductor wafers |x Design and construction | |
650 | 0 | |a Semiconductor | |
650 | 0 | |a Integrated circuits | |
907 | |a .b13942967 |b 28-05-21 |c 12-11-19 | ||
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990 | |a mh | ||
991 | |a Fakulti Kejuruteraan | ||
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