Keboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) /
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| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | Malay |
| Published: |
Bangi :
Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia,
2007
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| 040 | |a UKM | ||
| 090 | |a TK7871.85.S58 2007 tesis 3 | ||
| 090 | |a TK7871.85 |b .S58 2007 3 | ||
| 100 | 0 | |a Siti Hajar Abdullah | |
| 245 | 1 | 0 | |a Keboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) / |c Siti Hajar Abdullah |
| 260 | |a Bangi : |b Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, |c 2007 | ||
| 300 | |a xix, 124 p. : |b ill. ; |c 30 cm. | ||
| 502 | |a Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2007 | ||
| 504 | |a Rujukan : p. [111]-120 | ||
| 610 | 2 | 0 | |a Universiti Kebangsaan Malaysia |x Dissertations |
| 650 | 0 | |a Dissertations, Academic |z Malaysia | |
| 650 | 0 | |a Integrated circuits |x Wafer |x scale integration | |
| 650 | 0 | |a Semiconductor wafers | |
| 907 | |a .b14052489 |b 28-05-21 |c 12-11-19 | ||
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| 991 | |a Fakulti Kejuruteraan | ||
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