Keboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) /

Keboleharapan pakej skala wafer (WSP) menggunakan teknologi pengendapan nikel tanpa elektrik rendaman emas (ENIG) metalurgi bonggol bawahan (UBM) /

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Bibliographic Details
Main Author:	Siti Hajar Abdullah
Format:	Thesis Book
Language:	Malay
Published:	Bangi : Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, 2007
Subjects:	Universiti Kebangsaan Malaysia > Dissertations Dissertations, Academic > Malaysia Integrated circuits > Wafer > scale integration Semiconductor wafers
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