Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis Book |
| Language: | Malay |
| Published: |
2010
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| LEADER | 01210nam a2200301 a 4500 | ||
|---|---|---|---|
| 003 | UKM | ||
| 005 | 20110718131200.0 | ||
| 008 | 110705s2010 my a m 000 0 may | ||
| 039 | 9 | |a 201107181312 |b fati |y 07-05-2011 |z norehan | |
| 040 | |a UKM | ||
| 090 | |a TK7874.M844 2010 tesis | ||
| 090 | |a TK7874 |b .M844 2010 | ||
| 100 | 0 | |a Mohamad Firdaus Rosle | |
| 245 | 1 | 0 | |a Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN / |c Mohamad Firdaus bin Rosle |
| 260 | |c 2010 | ||
| 300 | |a xvi, 131 p. : |b ill. ; |c 30 cm. | ||
| 502 | |a Tesis (Sarjana Sains) - Universiti Kebangsaan Malaysia, 2010 | ||
| 504 | |a Rujukan : p. [113]-121 | ||
| 610 | 2 | 0 | |a Universiti Kebangsaan Malaysia |x Dissertations |
| 650 | 0 | |a Wire bonding (Electronic packaging) | |
| 650 | 0 | |a Electronic packaging | |
| 650 | 0 | |a Dissertations, Academic |z Malaysia | |
| 907 | |a .b15084619 |b 28-05-21 |c 12-11-19 | ||
| 998 | |a t |b 07-05-11 |c m |d x |e - |f may |g my |h 0 | ||
| 914 | |a vtls003471074 | ||
| 990 | |a nk/fka | ||
| 991 | |a Fakulti Sains dan Teknologi | ||
| 945 | |a TK7874.M844 2010 tesis (00008052076) |g 1 |i 00002032025 |j 0 |l t0040 |n No. of pieces: 1 |o - |p MYR0.00 |q - |r - |s - |t 3 |u 0 |v 0 |w 0 |x 0 |y .i19787704 |z 12-11-19 | ||