Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /
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| Main Author: | |
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| Format: | Thesis Book |
| Language: | Malay |
| Published: |
2011.
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| Subjects: | |
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| Physical Description: | xv, 96 p. : ill. , photographs, samples ; 30 cm. |
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| Bibliography: | Rujukan : p. [89]-93. |