Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /
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Main Author: | |
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Format: | Thesis Book |
Language: | Malay |
Published: |
2011.
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LEADER | 01439nam a2200337 a 4500 | ||
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003 | UKM | ||
005 | 20130530124100.0 | ||
008 | 130510s2011 my aol bm 000 0 may | ||
020 | |c Hadiah | ||
039 | 9 | |a 201305301241 |b lan |c 201305291436 |d hendon |c 201305271659 |d hendon |y 05-10-2013 |z norehan | |
040 | |a UKM | ||
090 | |a TK7836.S235 2011 tesis | ||
090 | |a TK7836 |b .S235 2011 | ||
100 | 0 | |a Saidatul Azura Radzi. | |
245 | 1 | 0 | |a Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) / |c Saidatul Azura binti Radzi. |
260 | |c 2011. | ||
300 | |a xv, 96 p. : |b ill. , photographs, samples ; |c 30 cm. | ||
502 | |a Tesis (M.Sc.) - Universiti Kebangsaan Malaysia, 2011. | ||
504 | |a Rujukan : p. [89]-93. | ||
593 | |a CD yang disertakan adalah duplikasi kepada tesis bercetak dan tidak boleh dirujuk/dipinjam | ||
610 | 2 | 0 | |a Universiti Kebangsaan Malaysia |x Dissertations. |
650 | 0 | |a Electric currents. | |
650 | 0 | |a Metal bonding. | |
650 | 0 | |a Wire bonding (Electronic packaging). | |
650 | 0 | |a Dissertations, Academic |z Malaysia. | |
907 | |a .b15633779 |b 28-09-20 |c 12-11-19 | ||
998 | |a t |b 05-10-13 |c m |d x |e - |f may |g my |h 0 | ||
914 | |a vtls003529733 | ||
990 | |a nk/ha | ||
991 | |a Fakulti Sains dan Teknologi | ||
945 | |a TK7836.S235 2011 [00008051987] |g 1 |i 00002093765 |j 0 |l t0040 |n No. of pieces: 1 |o - |p MYR0.00 |q - |r - |s - |t 3 |u 0 |v 0 |w 0 |x 0 |y .i20311795 |z 12-11-19 |