Study Of MSQ As Low-K Dielectric Material For Semiconductor Devices
High spped performance in VLSI devices requires the use of semiconductor materials such as copper interconnects and low-k dielectric. Low-k dielectric can reduce the parasitic capacitance between two metal lines, which allows higher operational speed as compared to silicon oxide.
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Main Author: | Wong, Man On |
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Format: | Thesis |
Published: |
2006
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