Characterisation and Optimisation of Fine Pitch Contactor for Integrated Circuit Packaging

The beginning of this study introduces the contactor characterisation methodology for parasitic inductance and capacitance extraction for IC packaging. The second section of this study explains the challenges of designing the fine pitch contactor and test board. The design optimisation for fine pit...

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Main Author:	Ong, Ling Li
Format:	Thesis
Published:	2016
Subjects:	TK7800-8360 Electronics
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id	my-mmu-ep.6899
record_format	uketd_dc
spelling	my-mmu-ep.68992017-09-07T11:00:06Z Characterisation and Optimisation of Fine Pitch Contactor for Integrated Circuit Packaging 2016-05 Ong, Ling Li TK7800-8360 Electronics The beginning of this study introduces the contactor characterisation methodology for parasitic inductance and capacitance extraction for IC packaging. The second section of this study explains the challenges of designing the fine pitch contactor and test board. The design optimisation for fine pitch contactor will be recommended at the end of thesis. Test contactor is part of the test tooling used in manufacturing for repeatability electrical testing. The main electrical conduction path is through the test contactor pin. When current flows through these contactor pins, the inductance and capacitance are generated along the electrical path. These parasitic inductance and capacitance contribute the channel losses and change the characteristic impedance of transmission line. As test contactor is part of the test tooling interfacing between package and test board, the signal integrity of the test contactor design must be well taken care. Any changes on the design parameters will affect the performance of test contactor. This work presents the inductance and capacitance characterisation methodology using ANSYS Q3D to study the impact of design parameters to the test contactor performance. 2016-05 Thesis http://shdl.mmu.edu.my/6899/ http://library.mmu.edu.my/diglib/onlinedb/dig_lib.php masters Multimedia University Faculty of Engineering and Technology
institution	Multimedia University
collection	MMU Institutional Repository
topic	TK7800-8360 Electronics
spellingShingle	TK7800-8360 Electronics Ong, Ling Li Characterisation and Optimisation of Fine Pitch Contactor for Integrated Circuit Packaging
description	The beginning of this study introduces the contactor characterisation methodology for parasitic inductance and capacitance extraction for IC packaging. The second section of this study explains the challenges of designing the fine pitch contactor and test board. The design optimisation for fine pitch contactor will be recommended at the end of thesis. Test contactor is part of the test tooling used in manufacturing for repeatability electrical testing. The main electrical conduction path is through the test contactor pin. When current flows through these contactor pins, the inductance and capacitance are generated along the electrical path. These parasitic inductance and capacitance contribute the channel losses and change the characteristic impedance of transmission line. As test contactor is part of the test tooling interfacing between package and test board, the signal integrity of the test contactor design must be well taken care. Any changes on the design parameters will affect the performance of test contactor. This work presents the inductance and capacitance characterisation methodology using ANSYS Q3D to study the impact of design parameters to the test contactor performance.
format	Thesis
qualification_level	Master's degree
author	Ong, Ling Li
author_facet	Ong, Ling Li
author_sort	Ong, Ling Li
title	Characterisation and Optimisation of Fine Pitch Contactor for Integrated Circuit Packaging
title_short	Characterisation and Optimisation of Fine Pitch Contactor for Integrated Circuit Packaging
title_full	Characterisation and Optimisation of Fine Pitch Contactor for Integrated Circuit Packaging
title_fullStr	Characterisation and Optimisation of Fine Pitch Contactor for Integrated Circuit Packaging
title_full_unstemmed	Characterisation and Optimisation of Fine Pitch Contactor for Integrated Circuit Packaging
title_sort	characterisation and optimisation of fine pitch contactor for integrated circuit packaging
granting_institution	Multimedia University
granting_department	Faculty of Engineering and Technology
publishDate	2016
_version_	1747829644054233088

Characterisation and Optimisation of Fine Pitch Contactor for Integrated Circuit Packaging

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