Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering
In this project, the effects of oxygen concentration on solder joint during reflow soldering are studied. Parameters studied include solder wetting angle, oxidation, microstructures and solder joint strength.
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2003
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my-mmu-ep.9612010-07-14T02:29:42Z Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering 2003-10 Chung, Chee Key TK7800-8360 Electronics In this project, the effects of oxygen concentration on solder joint during reflow soldering are studied. Parameters studied include solder wetting angle, oxidation, microstructures and solder joint strength. 2003-10 Thesis http://shdl.mmu.edu.my/961/ http://myto.perpun.net.my/metoalogin/logina.php masters Multimedia University Research Library |
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Multimedia University |
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MMU Institutional Repository |
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TK7800-8360 Electronics |
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TK7800-8360 Electronics Chung, Chee Key Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering |
description |
In this project, the effects of oxygen concentration on solder joint during reflow soldering are studied. Parameters studied include solder wetting angle, oxidation, microstructures and solder joint strength. |
format |
Thesis |
qualification_level |
Master's degree |
author |
Chung, Chee Key |
author_facet |
Chung, Chee Key |
author_sort |
Chung, Chee Key |
title |
Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering |
title_short |
Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering |
title_full |
Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering |
title_fullStr |
Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering |
title_full_unstemmed |
Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering |
title_sort |
effects of oxygen concentration on solder joints during reflow soldering |
granting_institution |
Multimedia University |
granting_department |
Research Library |
publishDate |
2003 |
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1747829273519980544 |