Steady-state structural analysis on copper and gold wire bonding using ANSYS / Suraya Khalid

The aim for this analysis is to perform simulation and steady-state analysis in structural discipline on wire bonding for various forces and pressure loading on both copper (Cu) and gold (Au) materials. This analysis will consider the size, temperature and properties of each material which resulting...

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Main Author:	Khalid, Suraya
Format:	Thesis
Language:	English
Published:	2012
Subjects:	Electric apparatus and materials Electric circuits Electric networks
Online Access:	https://ir.uitm.edu.my/id/eprint/102926/3/102926.pdf
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id	my-uitm-ir.102926
record_format	uketd_dc
spelling	my-uitm-ir.1029262024-11-26T07:11:06Z Steady-state structural analysis on copper and gold wire bonding using ANSYS / Suraya Khalid 2012 Khalid, Suraya Electric apparatus and materials. Electric circuits. Electric networks The aim for this analysis is to perform simulation and steady-state analysis in structural discipline on wire bonding for various forces and pressure loading on both copper (Cu) and gold (Au) materials. This analysis will consider the size, temperature and properties of each material which resulting the stress on structural. The features of the copper material such as much lower cost, high conductivity, high melting point and strong resistance make it an ideal choice for many new applications. The scope of this study includes the modeling of wire bonding, defining the geometries and properties of each material using finite element method. Simulation is conducted using software ANSYS Multiphysics in order to analyze the structural characteristics and the stress distribution of copper and gold wire bonding under thermocompression wire bonding process. This research focused on two parts; the free air ball and heat affected zone of the wire bonding structure. Results show that von Mises stress of gold wire bonding simulation is 1.25% than copper at pressure 300MPa while 9.1% difference at pressure 500MPa. For first principal, copper and gold show 6.45% difference at 300MPa and 9.35% difference at 500MPa. 2012 Thesis https://ir.uitm.edu.my/id/eprint/102926/ https://ir.uitm.edu.my/id/eprint/102926/3/102926.pdf text en public degree Universiti Teknologi MARA (UiTM) Faculty of Electrical Engineering
institution	Universiti Teknologi MARA
collection	UiTM Institutional Repository
language	English
topic	Electric apparatus and materials Electric circuits Electric networks
spellingShingle	Electric apparatus and materials Electric circuits Electric networks Khalid, Suraya Steady-state structural analysis on copper and gold wire bonding using ANSYS / Suraya Khalid
description	The aim for this analysis is to perform simulation and steady-state analysis in structural discipline on wire bonding for various forces and pressure loading on both copper (Cu) and gold (Au) materials. This analysis will consider the size, temperature and properties of each material which resulting the stress on structural. The features of the copper material such as much lower cost, high conductivity, high melting point and strong resistance make it an ideal choice for many new applications. The scope of this study includes the modeling of wire bonding, defining the geometries and properties of each material using finite element method. Simulation is conducted using software ANSYS Multiphysics in order to analyze the structural characteristics and the stress distribution of copper and gold wire bonding under thermocompression wire bonding process. This research focused on two parts; the free air ball and heat affected zone of the wire bonding structure. Results show that von Mises stress of gold wire bonding simulation is 1.25% than copper at pressure 300MPa while 9.1% difference at pressure 500MPa. For first principal, copper and gold show 6.45% difference at 300MPa and 9.35% difference at 500MPa.
format	Thesis
qualification_level	Bachelor degree
author	Khalid, Suraya
author_facet	Khalid, Suraya
author_sort	Khalid, Suraya
title	Steady-state structural analysis on copper and gold wire bonding using ANSYS / Suraya Khalid
title_short	Steady-state structural analysis on copper and gold wire bonding using ANSYS / Suraya Khalid
title_full	Steady-state structural analysis on copper and gold wire bonding using ANSYS / Suraya Khalid
title_fullStr	Steady-state structural analysis on copper and gold wire bonding using ANSYS / Suraya Khalid
title_full_unstemmed	Steady-state structural analysis on copper and gold wire bonding using ANSYS / Suraya Khalid
title_sort	steady-state structural analysis on copper and gold wire bonding using ansys / suraya khalid
granting_institution	Universiti Teknologi MARA (UiTM)
granting_department	Faculty of Electrical Engineering
publishDate	2012
url	https://ir.uitm.edu.my/id/eprint/102926/3/102926.pdf
_version_	1818588062751391744

Steady-state structural analysis on copper and gold wire bonding using ANSYS / Suraya Khalid

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