Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie

High performance and low temperature are important in designing a QFN package. This thesis discusses the design and analysis of a thermal effect based on the different epoxy thickness and material used. The different epoxy thickness combines the good features of the thermal resistance and rate of he...

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Main Author:	Mohd Safie, Mohd Syafiq
Format:	Thesis
Language:	English
Published:	2012
Online Access:	https://ir.uitm.edu.my/id/eprint/102998/1/102998.pdf
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id	my-uitm-ir.102998
record_format	uketd_dc
spelling	my-uitm-ir.1029982024-09-30T06:44:14Z Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie 2012 Mohd Safie, Mohd Syafiq High performance and low temperature are important in designing a QFN package. This thesis discusses the design and analysis of a thermal effect based on the different epoxy thickness and material used. The different epoxy thickness combines the good features of the thermal resistance and rate of heat flow in a QFN package. The QFN package design is focusing on the minimization of the package size and the temperature itself, which will improves the QFN package performance. This thesis will discuss how this project experimenting the thickness and material used to obtain the low temperature and high performance QFN package. The simulation results have been obtained using thermal flux, heat flow, and temperature are applied on the die, for load 50°C, 100°C and 125°C, considering steady-state analysis without vary with time. The simulation results are derived using ANSYS 13.0 software, which resulted nodal temperature, thermal gradient, and thermal flux. The results show that the lowest epoxy thickness and the material that have higher thermal conductivity give the lowest result of a thermal effect compared to the higher thickness and lowest thermal conductivity of a material. 2012 Thesis https://ir.uitm.edu.my/id/eprint/102998/ https://ir.uitm.edu.my/id/eprint/102998/1/102998.pdf text en public degree Universiti Teknologi MARA Faculty of Electrical Engineering
institution	Universiti Teknologi MARA
collection	UiTM Institutional Repository
language	English
description	High performance and low temperature are important in designing a QFN package. This thesis discusses the design and analysis of a thermal effect based on the different epoxy thickness and material used. The different epoxy thickness combines the good features of the thermal resistance and rate of heat flow in a QFN package. The QFN package design is focusing on the minimization of the package size and the temperature itself, which will improves the QFN package performance. This thesis will discuss how this project experimenting the thickness and material used to obtain the low temperature and high performance QFN package. The simulation results have been obtained using thermal flux, heat flow, and temperature are applied on the die, for load 50°C, 100°C and 125°C, considering steady-state analysis without vary with time. The simulation results are derived using ANSYS 13.0 software, which resulted nodal temperature, thermal gradient, and thermal flux. The results show that the lowest epoxy thickness and the material that have higher thermal conductivity give the lowest result of a thermal effect compared to the higher thickness and lowest thermal conductivity of a material.
format	Thesis
qualification_level	Bachelor degree
author	Mohd Safie, Mohd Syafiq
spellingShingle	Mohd Safie, Mohd Syafiq Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
author_facet	Mohd Safie, Mohd Syafiq
author_sort	Mohd Safie, Mohd Syafiq
title	Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
title_short	Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
title_full	Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
title_fullStr	Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
title_full_unstemmed	Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
title_sort	thermal analysis of a qfn package with different epoxy thickness and material using ansys / mohd syafiq mohd safie
granting_institution	Universiti Teknologi MARA
granting_department	Faculty of Electrical Engineering
publishDate	2012
url	https://ir.uitm.edu.my/id/eprint/102998/1/102998.pdf
_version_	1811769242667712512

Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie

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