Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie

High performance and low temperature are important in designing a QFN package. This thesis discusses the design and analysis of a thermal effect based on the different epoxy thickness and material used. The different epoxy thickness combines the good features of the thermal resistance and rate of he...

Full description

Saved in:
Bibliographic Details
Main Author: Mohd Safie, Mohd Syafiq
Format: Thesis
Language:English
Published: 2012
Online Access:https://ir.uitm.edu.my/id/eprint/102998/1/102998.pdf
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items