Heat transfer in switch / Muhamad Asraf Mohd

Most of the electronic system failures are because of thermal reasons. Therefore, the possibility of accurate prediction of device temperature is crucial for its design and modeling. The purpose of this project is to study the effect of heat transfer in a switch when Beryllium Copper is used as the...

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Bibliographic Details
Main Author:	Mohd, Muhamad Asraf
Format:	Thesis
Language:	English
Published:	2017
Subjects:	TK Electrical engineering Electronics Nuclear engineering
Online Access:	https://ir.uitm.edu.my/id/eprint/98483/1/98483.pdf
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id	my-uitm-ir.98483
record_format	uketd_dc
spelling	my-uitm-ir.984832024-07-28T16:06:57Z Heat transfer in switch / Muhamad Asraf Mohd 2017 Mohd, Muhamad Asraf TK Electrical engineering. Electronics. Nuclear engineering Most of the electronic system failures are because of thermal reasons. Therefore, the possibility of accurate prediction of device temperature is crucial for its design and modeling. The purpose of this project is to study the effect of heat transfer in a switch when Beryllium Copper is used as the base material and aluminum is used to be the connector of the switch when being supplied by 1.6 a by using same value of parameter of the switch and different value of parameter of the switch. 2017 Thesis https://ir.uitm.edu.my/id/eprint/98483/ https://ir.uitm.edu.my/id/eprint/98483/1/98483.pdf text en public degree Universiti Teknologi MARA (UiTM) Faculty of Electrical Engineering Alip, Rosalena Irma
institution	Universiti Teknologi MARA
collection	UiTM Institutional Repository
language	English
advisor	Alip, Rosalena Irma
topic	TK Electrical engineering Electronics Nuclear engineering
spellingShingle	TK Electrical engineering Electronics Nuclear engineering Mohd, Muhamad Asraf Heat transfer in switch / Muhamad Asraf Mohd
description	Most of the electronic system failures are because of thermal reasons. Therefore, the possibility of accurate prediction of device temperature is crucial for its design and modeling. The purpose of this project is to study the effect of heat transfer in a switch when Beryllium Copper is used as the base material and aluminum is used to be the connector of the switch when being supplied by 1.6 a by using same value of parameter of the switch and different value of parameter of the switch.
format	Thesis
qualification_level	Bachelor degree
author	Mohd, Muhamad Asraf
author_facet	Mohd, Muhamad Asraf
author_sort	Mohd, Muhamad Asraf
title	Heat transfer in switch / Muhamad Asraf Mohd
title_short	Heat transfer in switch / Muhamad Asraf Mohd
title_full	Heat transfer in switch / Muhamad Asraf Mohd
title_fullStr	Heat transfer in switch / Muhamad Asraf Mohd
title_full_unstemmed	Heat transfer in switch / Muhamad Asraf Mohd
title_sort	heat transfer in switch / muhamad asraf mohd
granting_institution	Universiti Teknologi MARA (UiTM)
granting_department	Faculty of Electrical Engineering
publishDate	2017
url	https://ir.uitm.edu.my/id/eprint/98483/1/98483.pdf
_version_	1811768925658021888

Heat transfer in switch / Muhamad Asraf Mohd

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