Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method
For decades, casting has been the most influential industrial manufacturing process to fabricate and promote higher properties of solder alloy. However, stirring technique which is commonly applies in casting method has brought some attentions for further discussions. According to literatures, the s...
Saved in:
Main Author: | Nadhrah, Murad |
---|---|
Format: | Thesis |
Language: | English |
Published: |
2021
|
Subjects: | |
Online Access: | http://umpir.ump.edu.my/id/eprint/34369/1/Microstructural%20evaluation%20of%20sn3.0ag0.5cu%20solder%20alloy.wm.pdf |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Influence of Alumina and Titanium Dioxide Nanoparticles Reinforcement on Sn-3.0ag-0.5cu and Sn-58bi Solder Alloys
by: Segar Singh, Amares Singh Gill
Published: (2015) -
Investigation on mechanical, microstructural and thermal properties of Sn-0.7Cu and Sn-1Ag-0.5Cu solder alloys bearing Fe and Bi /
by: Mahdavifard, Mohammad Hossein
Published: (2017) -
Isothermal Aging Of Sn-3.0ag-0.5cu And Sn100c Solder Alloys Processed Via Equal Channel Angular Pressing
by: Baser, Muhammad Fadlin Hazim
Published: (2020) -
Nano Particle Reinforced Lead-Free Sn–3.0Ag–0.5Cu Solder Paste for Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016) -
Nano Particle Reinforced Lead Free Sn–3.0ag–0.5cu Solder Paste For Reflow Soldering Process
by: Chellvarajoo, Srivalli
Published: (2016)