APA引文

Kesavarma, S. (2022). Investigation of mechanical behavior and properties prediction modelling of copper-filled filament for 3d printing.

Chicago Style (17th ed.) Citation

Kesavarma, Seluraju. Investigation of Mechanical Behavior and Properties Prediction Modelling of Copper-filled Filament for 3d Printing. 2022.

MLA引文

Kesavarma, Seluraju. Investigation of Mechanical Behavior and Properties Prediction Modelling of Copper-filled Filament for 3d Printing. 2022.

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