The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam

Epoxy foam was fabricated using sodium bicarbonate as the blowing agent. The epoxy foams were prepared using mechanical mixing method. Epoxy used in this study was product of bisphenol A and epichlorohydrin and the curing agent used was polyamide. In this study, the experiment part was consist of fo...

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Main Author:	Wan Nur Fadilla, Wan Hamad
Format:	Thesis
Language:	English
Subjects:	Epoxy foam Composites Structural analysis (Engineering) Sodium bicarbonate
Online Access:	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33278/1/P.1-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33278/2/Full%20text.pdf
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id	my-unimap-33278
record_format	uketd_dc
spelling	my-unimap-332782014-04-01T01:37:48Z The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam Wan Nur Fadilla, Wan Hamad Epoxy foam was fabricated using sodium bicarbonate as the blowing agent. The epoxy foams were prepared using mechanical mixing method. Epoxy used in this study was product of bisphenol A and epichlorohydrin and the curing agent used was polyamide. In this study, the experiment part was consist of four parts with four different processing conditions which were at room temperature, at 80°C, with presence of catalyst (acetic acid) and with presence of reactive diluent (butyl glycidyl ether). Viscosity, density, mechanical, dielectric and thermal properties were done for all the processing conditions. Blowing agent content was varied at 5, 10, 15, and 20 phr, respectively. For all processing conditions, 20 phr revealed the lowest value for viscosity, density, mechanical properties and dielectric properties. Among four parameters, the most desired result was observed in sample processed with acetic acid and with presence of diluent because it exhibited lower dielectric constant which prefer for electronic packaging application. However, flexural strength and modulus of these epoxy foams were reduced. Universiti Malaysia Perlis (UniMAP) 2011 Thesis en http://dspace.unimap.edu.my:80/dspace/handle/123456789/33278 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33278/1/P.1-24.pdf a68b0e5a64a23b14f23d0584d7caaa42 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33278/2/Full%20text.pdf ac31d423a6980075b9c1388a8868c266 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33278/3/license.txt 8a4605be74aa9ea9d79846c1fba20a33 Epoxy foam Composites Structural analysis (Engineering) Sodium bicarbonate
institution	Universiti Malaysia Perlis
collection	UniMAP Institutional Repository
language	English
topic	Epoxy foam Composites Structural analysis (Engineering) Sodium bicarbonate
spellingShingle	Epoxy foam Composites Structural analysis (Engineering) Sodium bicarbonate Wan Nur Fadilla, Wan Hamad The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
description	Epoxy foam was fabricated using sodium bicarbonate as the blowing agent. The epoxy foams were prepared using mechanical mixing method. Epoxy used in this study was product of bisphenol A and epichlorohydrin and the curing agent used was polyamide. In this study, the experiment part was consist of four parts with four different processing conditions which were at room temperature, at 80°C, with presence of catalyst (acetic acid) and with presence of reactive diluent (butyl glycidyl ether). Viscosity, density, mechanical, dielectric and thermal properties were done for all the processing conditions. Blowing agent content was varied at 5, 10, 15, and 20 phr, respectively. For all processing conditions, 20 phr revealed the lowest value for viscosity, density, mechanical properties and dielectric properties. Among four parameters, the most desired result was observed in sample processed with acetic acid and with presence of diluent because it exhibited lower dielectric constant which prefer for electronic packaging application. However, flexural strength and modulus of these epoxy foams were reduced.
format	Thesis
author	Wan Nur Fadilla, Wan Hamad
author_facet	Wan Nur Fadilla, Wan Hamad
author_sort	Wan Nur Fadilla, Wan Hamad
title	The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
title_short	The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
title_full	The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
title_fullStr	The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
title_full_unstemmed	The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
title_sort	effect of the processing conditions on the mechanical and dielectric properties of epoxy foam
granting_institution	Universiti Malaysia Perlis (UniMAP)
url	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33278/1/P.1-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33278/2/Full%20text.pdf
_version_	1747836806833897472

The effect of the processing conditions on the mechanical and dielectric properties of epoxy foam

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