Development of Lead-Free Sn-0.7Cu-Si3N4 composite solders
Lead based solder have been widely used before science have proven lead as one of the hazardous substances which can harm the environment and human health. With the banning usage of lead based solder as interconnect, various lead-free solders have been introduced and some of them are currently be...
محفوظ في:
المؤلف الرئيسي: | Muhammad Hafiz, Zan @ Hazizi |
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التنسيق: | أطروحة |
اللغة: | English |
الموضوعات: | |
الوصول للمادة أونلاين: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44220/1/p.1-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/44220/2/full%20text.pdf |
الوسوم: |
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مواد مشابهة
- Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
- Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
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Fabrication and characterization of hybrid microwave assisted sintering Sn-0.7Cu + 1.0wt.% Si₃N₄ composite solder
بواسطة: Flora, Somidin -
The effect of copper powder addition on spreading characteristics and mechanical behaviour of Sn-Ag-Cu solder /
بواسطة: Angellia, Lian Dewi
منشور في: (2009) -
Solderability of Sn-Cu-based lead-free solder with low content of silver and indium /
بواسطة: Dharma, I Gusti Bagus Budi