Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique
The revolution of electronic applications which have been assembled in smaller parts, lighter and more functional, causes the solder to become crucial over the worlds. These classes of low melting point alloys must provide a unique set properties to ensure the reliability of the electronic assemblie...
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| Format: | Thesis |
|---|---|
| Language: | English |
| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77087/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77087/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77087/4/Sayyidah.pdf |
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