Study the effect of isothermal aging on Sn-Ag-Cu (SAC) lead-free solder added with silicon carbide (SiC)
The usage of composite solder is one of the method in improving stability of the solder joints. Addition of certain particles such SiC to form a composite solder has been given greater attention since it can enhance the mechanical properties of solder and has been proven by other researchers. Thi...
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| 格式: | Thesis |
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| 语言: | English |
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| 在线阅读: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77544/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77544/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77544/3/Declaration%20Form.pdf |
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