Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route

The composite technology is the new approach to improve the service temperature capabilities and thermal stability of the solder joints. Low-silver Sn98.3-Ag1.0-Cu0.7 (SAC107) and Sn99.3-Cu0.7 (Sn-0.7Cu) solders were used as matrix while silicon nitride (Si3N4) with different weight fractions (0, 0...

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Format:	Thesis
Language:	English
Subjects:	Solder and soldering Powder Metallurgy Sintering Soldering technology Solders
Online Access:	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/4/Norhayanti.pdf
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spelling	my-unimap-779842023-03-06T02:31:57Z Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route Norainiza, Saud, Dr. The composite technology is the new approach to improve the service temperature capabilities and thermal stability of the solder joints. Low-silver Sn98.3-Ag1.0-Cu0.7 (SAC107) and Sn99.3-Cu0.7 (Sn-0.7Cu) solders were used as matrix while silicon nitride (Si3N4) with different weight fractions (0, 0.25, 0.5, 0.75 and 1.0 wt. %) were added as reinforcement particles. The solder composites were prepared by using powder metallurgy method consists of mixing, compaction and sintering via microwave assisted rapid sintering. This microwave sintering approach results in more uniform heating with cost-effective and energy efficiency. The research project was divided into two phases. The first phase involves the fabrication and characterization of electrical, thermal, microstructural and mechanical properties of the bulk composite solder. The second phase was the studies on the properties of microstructural, solderability and mechanical properties as-reflowed solder joint/interconnection. It was noted that finer and well distributed reinforcement precipitates has led to higher microhardness and slightly decreased in melting point and electrical resistivity of bulk composite solder. The wettability performance of composite solder was improved. Correspondingly, the intermetallic compound (IMC) thickness was suppressed during the soldering. The dispersion strengthening effect enhances the shear strength and the fracture surface exhibit the ductile fracture mode with rough dimple surface instead of brittle fracture mode at the interface (substrate/solder) of composite solder joints. Overall, the addition of reinforcements into lead-free solder alloy matrix has improved all the listed properties of the solder materials. Universiti Malaysia Perlis (UniMAP) Thesis en http://dspace.unimap.edu.my:80/xmlui/handle/123456789/77984 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/3/license.txt 8a4605be74aa9ea9d79846c1fba20a33 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/1/Page%201-24.pdf 3f50dab5d44c2cf0e81e753086acbc7f http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/2/Full%20text.pdf 33e8bfe0f6e6373de0deb2139f76ba74 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/4/Norhayanti.pdf ebfd77fee023c4f6b15fdbc1c51b2ce7 Universiti Malaysia Perlis (UniMAP) Solder and soldering Powder Metallurgy Sintering Soldering technology Solders School of Materials Engineering
institution	Universiti Malaysia Perlis
collection	UniMAP Institutional Repository
language	English
advisor	Norainiza, Saud, Dr.
topic	Solder and soldering Powder Metallurgy Sintering Soldering technology Solders
spellingShingle	Solder and soldering Powder Metallurgy Sintering Soldering technology Solders Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
description	The composite technology is the new approach to improve the service temperature capabilities and thermal stability of the solder joints. Low-silver Sn98.3-Ag1.0-Cu0.7 (SAC107) and Sn99.3-Cu0.7 (Sn-0.7Cu) solders were used as matrix while silicon nitride (Si3N4) with different weight fractions (0, 0.25, 0.5, 0.75 and 1.0 wt. %) were added as reinforcement particles. The solder composites were prepared by using powder metallurgy method consists of mixing, compaction and sintering via microwave assisted rapid sintering. This microwave sintering approach results in more uniform heating with cost-effective and energy efficiency. The research project was divided into two phases. The first phase involves the fabrication and characterization of electrical, thermal, microstructural and mechanical properties of the bulk composite solder. The second phase was the studies on the properties of microstructural, solderability and mechanical properties as-reflowed solder joint/interconnection. It was noted that finer and well distributed reinforcement precipitates has led to higher microhardness and slightly decreased in melting point and electrical resistivity of bulk composite solder. The wettability performance of composite solder was improved. Correspondingly, the intermetallic compound (IMC) thickness was suppressed during the soldering. The dispersion strengthening effect enhances the shear strength and the fracture surface exhibit the ductile fracture mode with rough dimple surface instead of brittle fracture mode at the interface (substrate/solder) of composite solder joints. Overall, the addition of reinforcements into lead-free solder alloy matrix has improved all the listed properties of the solder materials.
format	Thesis
title	Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
title_short	Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
title_full	Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
title_fullStr	Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
title_full_unstemmed	Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
title_sort	fabrication of sac107 and sn-0.7cu lead free composite solder reinforced with si3n4 via powder metallurgy route
granting_institution	Universiti Malaysia Perlis (UniMAP)
granting_department	School of Materials Engineering
url	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/4/Norhayanti.pdf
_version_	1776104239976677376

Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route

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