Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route

Nowadays, composite solder has gain researcher’s attention due to its promising improvement in physical and mechanical properties for lead free solder. This study was carried out to investigate the effect of SiC particle on microstructure evolution, physical and mechanical properties of SAC and SnCu...

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Format: Thesis
Language:English
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Online Access:http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/78028/1/Page%201-24.pdf
http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/78028/2/Full%20text.pdf
http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/78028/3/Zawawi.pdf
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