The Development of a No-Clean Solder for Radio Frequency Power Module
The pursue of CFC elimination in many industries has opened up opportunity for the development of substitutes of CFC. No-clean solder is just one of the many examples in response to this need. This project describes the development of no-clean solder for radio frequency (RF) Power Module. Nine n...
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| Format: | Thesis |
| Language: | English English |
| Published: |
1997
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| Subjects: | |
| Online Access: | http://psasir.upm.edu.my/id/eprint/10021/1/FK_1997_15_A.pdf |
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| Summary: | The pursue of CFC elimination in many industries has opened up
opportunity for the development of substitutes of CFC. No-clean solder is
just one of the many examples in response to this need. This project describes
the development of no-clean solder for radio frequency (RF) Power Module.
Nine no-clean solder paste candidates ranging from different solder paste
suppliers which are Heraeus, Indalloy, Multicore, Qualitek, Asahi Solders,
Demetron, Koki, SCM and Alphametals were selected. Five solder preliminary
tests which are flux weight loss, wetting, slump, solder balling, flux spread and
four solder printing characteristics which are paste rolling solder coverage,
solder fillet and joint texture were used as a tool to select the best no-clean
solder that meet the product requirements. Heraeus and Indalloy no-clean
solder pastes showed better results compared to others but still required
some process changes. Two methods were used in order to eliminate the
solder defects which are the development of the new stencil and new
soldering reflow profile. These methods able to resolve the solder defects
problem such as flux overflow, solder cold joint, solder splashing and solder balling formation. The selected no-clean solder paste together with the normal
production solder paste known as control solder paste were further subjected
to the paste level evaluations and the reliability tests. It was found that the
Heraeus and Indalloy no-clean solder paste are the best candidates for noclean
solder process capability. The results of these tests are presented and
discussed in this thesis. |
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