Bismuth-argentum alloys as alternative high temperature lead-free solder
Solder reaction is one of the oldest metallurgical processes for joining metal parts. Today, the use of solder in modern microelectronic technology is ubiquitous. Lead solder has been widely used in the semiconductor industry for a long time. However,despite the long term acceptance of lead by huma...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2012
|
| Subjects: | |
| Online Access: | http://psasir.upm.edu.my/id/eprint/43373/1/FK%202012%2028R.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Be the first to leave a comment!