Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
Critical evaluation of interconnection materials developed from composite solder materials and a comprehensive comparison of the joints with the host solder alloy are cardinal to the quest of divulging a more decent and dependable alternative to the existing solder candidate. In this study, the effe...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2015
|
| Subjects: | |
| Online Access: | http://psasir.upm.edu.my/id/eprint/56593/1/FK%202015%2014RR.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Be the first to leave a comment!