Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging

Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. TPM is designed to get maximum efficiency from the equipment while creating a satisfactory working environment. In Motorola, Selangor yield improvement had been an impor...

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Main Author:	Dharmalingam, Sivakumar
Format:	Thesis
Language:	English
Published:	2004
Subjects:	Microelectronic packaging - Total roduction maintenance - Case studies
Online Access:	http://psasir.upm.edu.my/id/eprint/5897/1/FK_2004_8%20IR.pdf
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id	my-upm-ir.5897
record_format	uketd_dc
spelling	my-upm-ir.58972022-02-03T01:50:18Z Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging 2004-02 Dharmalingam, Sivakumar Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. TPM is designed to get maximum efficiency from the equipment while creating a satisfactory working environment. In Motorola, Selangor yield improvement had been an important agenda. One of the TPM pillar which is Focus Improvement activity is designed to minimize targeted losses that had been carefully measured and evaluated, was employed to improve yield in front-end assembly. The top three yield lost in parts per million (ppm) were contributed by the following defects in descending order: Non Stick on Pad (2715 ppm), chip and crack (782 ppm) and missing wire (687 ppni). The team focused on Non Stick on Pad (NSOP). which was the top yield lost contributor. NSOP was due to: floating die, bonded ball small in size, foreign matter on pad and classifications to say a few. Floating die contributed 48% of the NSOP defect. In this project detailed Microelectronic packaging - Total roduction maintenance - Case studies 2004-02 Thesis http://psasir.upm.edu.my/id/eprint/5897/ http://psasir.upm.edu.my/id/eprint/5897/1/FK_2004_8%20IR.pdf text en public masters Universiti Putra Malaysia Microelectronic packaging - Total roduction maintenance - Case studies Engineering Ismail, Napsiah
institution	Universiti Putra Malaysia
collection	PSAS Institutional Repository
language	English
advisor	Ismail, Napsiah
topic	Microelectronic packaging - Total roduction maintenance - Case studies
spellingShingle	Microelectronic packaging - Total roduction maintenance - Case studies Dharmalingam, Sivakumar Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging
description	Total Productive Maintenance (TPM) methodologies are used to eliminate profit loss or waste due to equipment failure or defect. TPM is designed to get maximum efficiency from the equipment while creating a satisfactory working environment. In Motorola, Selangor yield improvement had been an important agenda. One of the TPM pillar which is Focus Improvement activity is designed to minimize targeted losses that had been carefully measured and evaluated, was employed to improve yield in front-end assembly. The top three yield lost in parts per million (ppm) were contributed by the following defects in descending order: Non Stick on Pad (2715 ppm), chip and crack (782 ppm) and missing wire (687 ppni). The team focused on Non Stick on Pad (NSOP). which was the top yield lost contributor. NSOP was due to: floating die, bonded ball small in size, foreign matter on pad and classifications to say a few. Floating die contributed 48% of the NSOP defect. In this project detailed
format	Thesis
qualification_level	Master's degree
author	Dharmalingam, Sivakumar
author_facet	Dharmalingam, Sivakumar
author_sort	Dharmalingam, Sivakumar
title	Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging
title_short	Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging
title_full	Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging
title_fullStr	Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging
title_full_unstemmed	Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging
title_sort	application of focus improvement to reduce non-stick on pad problem in ic packaging
granting_institution	Universiti Putra Malaysia
granting_department	Engineering
publishDate	2004
url	http://psasir.upm.edu.my/id/eprint/5897/1/FK_2004_8%20IR.pdf
_version_	1747810505003630592

Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging

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