Interfacial analysis of carbon nanotubes-reinforced and graphene-reinforced Sn-1.0Ag-0.5Cu solder on electroless nickel/ immersion silver surface finish
Interconnection material examination of composite solder materials and general comparison of the joints with the solder alloy are fundamental to search for more comparable and dependable alternative to the solder candidate. In this investigation, SAC105 carries two reinforced parameters, carbo...
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Main Author: | Krishna, Vidyatharran |
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Format: | Thesis |
Language: | English |
Published: |
2020
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Subjects: | |
Online Access: | http://psasir.upm.edu.my/id/eprint/97861/1/FK%202021%2040%20UPMIR.pdf |
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