Investigations On Silver-Copper Nanopaste As Die-Attach Material For High Temperature Applications
Satu nano-pes argentum-kuprum (Ag-Cu) yang dirumuskan dengan mencampurkan nanopartikel Ag dan Cu dengan penambah organik (pelekat resin, terpineol dan ethylene glycol) telah dihasilkan bagi diaplikasikan sebagai bahan lampir-dai suhu tinggi. Pelbagai peratus berat nanopartikel Cu (20-80 wt%) tela...
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Main Author: | Tan , Kim Seah |
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Format: | Thesis |
Language: | English |
Published: |
2015
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Subjects: | |
Online Access: | http://eprints.usm.my/30367/1/Thesis_%28Tan_Kim_Seah%29.pdf |
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