Fabrication And Properties Of Silicaepoxy Thin Film Composite

With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties...

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Main Author:	Foo , Yin Lin Evon
Format:	Thesis
Language:	English
Published:	2012
Subjects:	TN263-271 Mineral deposits Metallic ore deposits Prospecting
Online Access:	http://eprints.usm.my/41124/1/FOO_YIN_LIN_EVON_24_Pages.pdf
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id	my-usm-ep.41124
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spelling	my-usm-ep.411242018-07-20T07:58:13Z Fabrication And Properties Of Silicaepoxy Thin Film Composite 2012 Foo , Yin Lin Evon TN263-271 Mineral deposits. Metallic ore deposits. Prospecting With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of the thin film composites using micron-silica (µ-Si) and nano-silica (n-Si) fillers were compared. Low loading of n-Si thin film composites was found to have the ability to achieve equivalent tensile and thermal properties compared to the highly loaded µ-Si thin film composite. With higher surface area to volume ratio, n-Si shows its capability to achieve a substantial performance with -Si. In terms of curing agents, imidazole cured thin film was found to have better mechanical and thermal properties due to the presence of five membered ring in the imidazole chemical structure. The moisture absorption of the imidazole cured samples were slightly higher than the polyetheramine cured samples because imidazole cured resin is a polar resin. The dispersion of the n-Si filler was improved by the treatment of n-Si with (3-Glycidyloxypropyl) trimethoxysilane coupling agent. It was observed that 8 hours treatment time showed high mechanical properties of the thin film composites. Prolong treatment time caused the drop in tensile modulus and tensile strength but increase the flexibility of the thin film composites. The presence of treated n-Si in the composite system causes the increase in the coefficient of thermal expansion (CTE) value and lowers the thermal stability compared to the untreated n-Si thin film composites. However, treatment of the n-Si was found to cause the modification of the hydrophilic n-Si surface into a hydrophobic surface, thus reduced the moisture absorption of the thin film composites. 2012 Thesis http://eprints.usm.my/41124/ http://eprints.usm.my/41124/1/FOO_YIN_LIN_EVON_24_Pages.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TN263-271 Mineral deposits Metallic ore deposits Prospecting
spellingShingle	TN263-271 Mineral deposits Metallic ore deposits Prospecting Foo , Yin Lin Evon Fabrication And Properties Of Silicaepoxy Thin Film Composite
description	With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties of the thin film composites using micron-silica (µ-Si) and nano-silica (n-Si) fillers were compared. Low loading of n-Si thin film composites was found to have the ability to achieve equivalent tensile and thermal properties compared to the highly loaded µ-Si thin film composite. With higher surface area to volume ratio, n-Si shows its capability to achieve a substantial performance with -Si. In terms of curing agents, imidazole cured thin film was found to have better mechanical and thermal properties due to the presence of five membered ring in the imidazole chemical structure. The moisture absorption of the imidazole cured samples were slightly higher than the polyetheramine cured samples because imidazole cured resin is a polar resin. The dispersion of the n-Si filler was improved by the treatment of n-Si with (3-Glycidyloxypropyl) trimethoxysilane coupling agent. It was observed that 8 hours treatment time showed high mechanical properties of the thin film composites. Prolong treatment time caused the drop in tensile modulus and tensile strength but increase the flexibility of the thin film composites. The presence of treated n-Si in the composite system causes the increase in the coefficient of thermal expansion (CTE) value and lowers the thermal stability compared to the untreated n-Si thin film composites. However, treatment of the n-Si was found to cause the modification of the hydrophilic n-Si surface into a hydrophobic surface, thus reduced the moisture absorption of the thin film composites.
format	Thesis
qualification_level	Master's degree
author	Foo , Yin Lin Evon
author_facet	Foo , Yin Lin Evon
author_sort	Foo , Yin Lin Evon
title	Fabrication And Properties Of Silicaepoxy Thin Film Composite
title_short	Fabrication And Properties Of Silicaepoxy Thin Film Composite
title_full	Fabrication And Properties Of Silicaepoxy Thin Film Composite
title_fullStr	Fabrication And Properties Of Silicaepoxy Thin Film Composite
title_full_unstemmed	Fabrication And Properties Of Silicaepoxy Thin Film Composite
title_sort	fabrication and properties of silicaepoxy thin film composite
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Bahan dan Sumber Mineral
publishDate	2012
url	http://eprints.usm.my/41124/1/FOO_YIN_LIN_EVON_24_Pages.pdf
_version_	1747820878266105856

Fabrication And Properties Of Silicaepoxy Thin Film Composite

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