Fabrication And Properties Of Silicaepoxy Thin Film Composite
With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties...
Saved in:
| 主要作者: | |
|---|---|
| 格式: | Thesis |
| 语言: | English |
| 出版: |
2012
|
| 主题: | |
| 在线阅读: | http://eprints.usm.my/41124/1/FOO_YIN_LIN_EVON_24_Pages.pdf |
| 标签: |
添加标签
没有标签, 成为第一个标记此记录!
|
成为第一个发表评论!