Fabrication And Properties Of Silicaepoxy Thin Film Composite
With the increasing interest in high density electronics packaging, dimensional scaling becomes the key to evolution. In this study, epoxy thin film composites with silica fillers were fabricated using spin coating process. In the first part of this research, the mechanical and thermal properties...
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| 主要作者: | |
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| 格式: | Thesis |
| 語言: | English |
| 出版: |
2012
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| 主題: | |
| 在線閱讀: | http://eprints.usm.my/41124/1/FOO_YIN_LIN_EVON_24_Pages.pdf |
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