Numerical And Experimental Analyses Of Piezoelectric Fans For Microelectronics Cooling
With the advancement of science and technology, electronic products work faster and perform more functions. Also electronic products are shrinking in size and weight that have increased volumetric heat generation rates and surface heat fluxes over their components. Hence, it is important to develop...
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| Format: | Thesis |
| Language: | English |
| Published: |
2010
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| Subjects: | |
| Online Access: | http://eprints.usm.my/41997/1/MARAM_VENKATA_RAMANA.pdf |
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| Summary: | With the advancement of science and technology, electronic products work faster and perform more functions. Also electronic products are shrinking in size and weight that have increased volumetric heat generation rates and surface heat fluxes over their components. Hence, it is important to develop a new cooling technology to improve performance of microelectronic components, which motivates the usage of cantilever type piezoelectric bimorph structure as a miniature fan. These piezoelectric bimorph structures have been investigated as alternative cooling mechanism for cooling microelectronic components. Parameters such as length, thickness, width and location of the piezoceramic layer to perform at the optimum level are studied here in. This process involves solving static, modal and harmonic simulations repeatedly. |
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