Electroless Copper Composite Coatings Reinforced With Silicon Carbide And Graphite Particles
In this work, Cu–P, Cu–P–SiC, Cu–P–Cg and Cu–P–Cg–SiC composite coatings were deposited by means of electroless plating. The effects of pH, temperature and different concentrations of NaH2PO2·H2O, NiSO4·6H2O, silicon carbide (SiC) and graphite (Cg) on the deposition rate and the coating compositions...
محفوظ في:
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| اللغة: | English |
| منشور في: |
2011
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.usm.my/42704/1/SOHEILA_FARAJI.pdf |
| الوسوم: |
إضافة وسم
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| الملخص: | In this work, Cu–P, Cu–P–SiC, Cu–P–Cg and Cu–P–Cg–SiC composite coatings were deposited by means of electroless plating. The effects of pH, temperature and different concentrations of NaH2PO2·H2O, NiSO4·6H2O, silicon carbide (SiC) and graphite (Cg) on the deposition rate and the coating compositions were evaluated and the bath formulation for the Cu–P–Cg–SiC composite coatings was optimised. The corresponding optimal operating parameters for depositing Cu–P–Cg–SiC were found to be pH 9, temperature at 90 ºC, concentrations of NaH2PO2·H2O at 125 g L-1, CuSO4·5H2O at 25 g L-1, NiSO4·6H2O at 3.125 g L-1, SiC at 5 g L-1, Cg at 5 g L-1, C6H5Na3O7·2H2O at 50 g L-1 and H3BO3 at 25 g L-1. |
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