Intermetallic Compound And Reliability Study Of Sac And Snbi Lead Free Solders
Due to the environmental concern for lead toxicity, the use of lead-free solder has been widespread in electronic packaging industries. In order for lead-free solder to replace the current lead solder, lead-free solder should have as close melting point as lead solder (1830C) and also has good wetta...
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Main Author: | Wahab, Abdul Karim Abdul |
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Format: | Thesis |
Language: | English |
Published: |
2011
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Subjects: | |
Online Access: | http://eprints.usm.my/43190/1/ABDUL%20KARIM%20ABDUL%20WAHAB.pdf |
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