Effect Of Indium On Microstructure And Intermetallic Compound Formation During Isothermal Aging Of Sncu Solder Alloy

Solder is the interconnect material serving both electrical and mechanical connections between components and substrate in electronic devices. Concern over the toxicity of lead sparked intense focus on finding alternative lead-free solders to replace the traditional Sn-Pb solder. Among the lead-free...

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主要作者: Khusaini, Nur Nadirah Mohd
格式: Thesis
语言:English
出版: 2018
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在线阅读:http://eprints.usm.my/46688/1/Effect%20Of%20Indium%20On%20Microstructure%20And%20Intermetallic%20Compound%20Formation%20During%20Isothermal%20Aging%20Of%20Sncu%20Solder%20Alloy.pdf
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