Effect Of Indium On Microstructure And Intermetallic Compound Formation During Isothermal Aging Of Sncu Solder Alloy
Solder is the interconnect material serving both electrical and mechanical connections between components and substrate in electronic devices. Concern over the toxicity of lead sparked intense focus on finding alternative lead-free solders to replace the traditional Sn-Pb solder. Among the lead-free...
محفوظ في:
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| اللغة: | English |
| منشور في: |
2018
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| الموضوعات: | |
| الوصول للمادة أونلاين: | http://eprints.usm.my/46688/1/Effect%20Of%20Indium%20On%20Microstructure%20And%20Intermetallic%20Compound%20Formation%20During%20Isothermal%20Aging%20Of%20Sncu%20Solder%20Alloy.pdf |
| الوسوم: |
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