Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application

Rapid development in wireless commination devices was lead to seriousness in electromagnetic pollution. The main aim of this study is develop an effective electromagnetic interferences (EMI) shielding composites for electronic packaging application. In the present study, an EMI shielding epoxy compo...

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Main Author:	Phan, Chee Hong
Format:	Thesis
Language:	English
Published:	2015
Subjects:	T Technology
Online Access:	http://eprints.usm.my/46762/1/Fabrication%20And%20Properties%20Of%20Electromagnetic%20Interferences%20Shielding%20Epoxy%20Composites%20For%20Electronic%20Packaging%20Application.pdf
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spelling	my-usm-ep.467622021-11-17T03:42:19Z Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application 2015-09-01 Phan, Chee Hong T Technology TA401-492 Materials of engineering and construction. Mechanics of materials Rapid development in wireless commination devices was lead to seriousness in electromagnetic pollution. The main aim of this study is develop an effective electromagnetic interferences (EMI) shielding composites for electronic packaging application. In the present study, an EMI shielding epoxy composites have been fabricated by incorporated both multiwalled carbon nanotubes (MWCNTs) and manganese zinc ferrites (MnZn ferrites) in epoxy matrix. MWCNTs was functionalized with concentrated nitric acid with various functionalization reaction time. MWCNTs with 2 hours functionalization treatment shows enhancement in colloidal suspension stability, dispersion, electrical conductivity, dielectric properties and EMI shielding effectiveness (SE) as compared with pristine MWCNTs. This is due to presence of oxygenic functional groups on the surface of nanotube as observed within Fourier transform infra-red spectroscopic spectra. However, the properties of functionalized MWNCTs/ epoxy composites decrease for more than 2 hours treatment due to extensive damage of its structure as verified with Raman spectroscopy. In the second part of the study, MnZn ferrite was synthesized via citrate gel method with various calcination temperature. It is found that as the calcination temperature increases, the higher phase purity and larger particle size of MnZn ferrite were obtained. MnZn ferrite nanoparticle calcinated at 1000 °C exhibited the highest phase purity with average particle size of 856.4 nm. In the study of functionalized MWCNTs/ MnZn ferrite epoxy composite, fillers ratio of 3:1 showed the highest EMI SE and the shielding mechanism of the composite was dominated by absorption. It is observed that the EMI shielding effectiveness of composites were increased with the filler loading and composites thickness. It is also found that the EMI shielding performance of 2.0 mm fabricated composite, with the filler loading of 4.0 vol.% and applied of conductive back-layer, was comparable with commercial EMI shielding gaskets/pads. Maximum SE of 65 dB at 9 GHz was obtained for the EMI shielding polymer composites produced in the present study. 2015-09 Thesis http://eprints.usm.my/46762/ http://eprints.usm.my/46762/1/Fabrication%20And%20Properties%20Of%20Electromagnetic%20Interferences%20Shielding%20Epoxy%20Composites%20For%20Electronic%20Packaging%20Application.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	T Technology T Technology
spellingShingle	T Technology T Technology Phan, Chee Hong Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application
description	Rapid development in wireless commination devices was lead to seriousness in electromagnetic pollution. The main aim of this study is develop an effective electromagnetic interferences (EMI) shielding composites for electronic packaging application. In the present study, an EMI shielding epoxy composites have been fabricated by incorporated both multiwalled carbon nanotubes (MWCNTs) and manganese zinc ferrites (MnZn ferrites) in epoxy matrix. MWCNTs was functionalized with concentrated nitric acid with various functionalization reaction time. MWCNTs with 2 hours functionalization treatment shows enhancement in colloidal suspension stability, dispersion, electrical conductivity, dielectric properties and EMI shielding effectiveness (SE) as compared with pristine MWCNTs. This is due to presence of oxygenic functional groups on the surface of nanotube as observed within Fourier transform infra-red spectroscopic spectra. However, the properties of functionalized MWNCTs/ epoxy composites decrease for more than 2 hours treatment due to extensive damage of its structure as verified with Raman spectroscopy. In the second part of the study, MnZn ferrite was synthesized via citrate gel method with various calcination temperature. It is found that as the calcination temperature increases, the higher phase purity and larger particle size of MnZn ferrite were obtained. MnZn ferrite nanoparticle calcinated at 1000 °C exhibited the highest phase purity with average particle size of 856.4 nm. In the study of functionalized MWCNTs/ MnZn ferrite epoxy composite, fillers ratio of 3:1 showed the highest EMI SE and the shielding mechanism of the composite was dominated by absorption. It is observed that the EMI shielding effectiveness of composites were increased with the filler loading and composites thickness. It is also found that the EMI shielding performance of 2.0 mm fabricated composite, with the filler loading of 4.0 vol.% and applied of conductive back-layer, was comparable with commercial EMI shielding gaskets/pads. Maximum SE of 65 dB at 9 GHz was obtained for the EMI shielding polymer composites produced in the present study.
format	Thesis
qualification_level	Master's degree
author	Phan, Chee Hong
author_facet	Phan, Chee Hong
author_sort	Phan, Chee Hong
title	Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application
title_short	Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application
title_full	Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application
title_fullStr	Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application
title_full_unstemmed	Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application
title_sort	fabrication and properties of electromagnetic interferences shielding epoxy composites for electronic packaging application
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral
publishDate	2015
url	http://eprints.usm.my/46762/1/Fabrication%20And%20Properties%20Of%20Electromagnetic%20Interferences%20Shielding%20Epoxy%20Composites%20For%20Electronic%20Packaging%20Application.pdf
_version_	1747821724336914432

Fabrication And Properties Of Electromagnetic Interferences Shielding Epoxy Composites For Electronic Packaging Application

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