Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607].
Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase...
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2004
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Online Access: | http://eprints.usm.my/6319/1/THERMAL_INVESTIGATIONS_OF_FLIP_CHIP_MICROELECTRONIC_PACKAGE_WITH_NON-UNIFORM_POWER_DISTRIBUTION.pdf |
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my-usm-ep.63192013-07-13T03:25:03Z Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607]. 2004-06 Goh, Teck Joo TK7800-8360 Electronics Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang kepada peningkatan kadar penjanaan haba. The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation. 2004-06 Thesis http://eprints.usm.my/6319/ http://eprints.usm.my/6319/1/THERMAL_INVESTIGATIONS_OF_FLIP_CHIP_MICROELECTRONIC_PACKAGE_WITH_NON-UNIFORM_POWER_DISTRIBUTION.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Mekanik |
institution |
Universiti Sains Malaysia |
collection |
USM Institutional Repository |
language |
English |
topic |
TK7800-8360 Electronics |
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TK7800-8360 Electronics Goh, Teck Joo Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb] [Microfiche 7607]. |
description |
Arah aliran pempakejan sistem-sistem dan subsistem mikroelektronik adalah kearah pengurangan saiz dan peningkatan prestasi, di mana kedua-duanya menyumbang
kepada peningkatan kadar penjanaan haba.
The trend in packaging microelectronic systems and subsystems has been to reduce size and increase performance, both of which contribute to increase heat generation. |
format |
Thesis |
qualification_name |
Doctor of Philosophy (PhD.) |
qualification_level |
Doctorate |
author |
Goh, Teck Joo |
author_facet |
Goh, Teck Joo |
author_sort |
Goh, Teck Joo |
title |
Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
|
title_short |
Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
|
title_full |
Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
|
title_fullStr |
Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
|
title_full_unstemmed |
Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
|
title_sort |
thermal investigations of flip chip microelectronic package with non-uniform power distribution [tk7874. g614 2004 f rb]
[microfiche 7607]. |
granting_institution |
Universiti Sains Malaysia |
granting_department |
Pusat Pengajian Kejuruteraan Mekanik |
publishDate |
2004 |
url |
http://eprints.usm.my/6319/1/THERMAL_INVESTIGATIONS_OF_FLIP_CHIP_MICROELECTRONIC_PACKAGE_WITH_NON-UNIFORM_POWER_DISTRIBUTION.pdf |
_version_ |
1747819675949989888 |