Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS

This master project proposed is to look insight into semiconductor field related project which has the topic of IMPROVEMENT OF MOLDING PROCESS SCHEDULED DOWNTIME FOR INTEGRATED CIRCUITS PACKAGE DPAK STS where common name of Dpak will be power product T0252 series. First and foremost, the topic invol...

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Main Author:	Heng, Soo Ann
Format:	Thesis
Language:	English English
Published:	2016
Subjects:	T Technology (General) TP Chemical technology
Online Access:	http://eprints.utem.edu.my/id/eprint/20941/1/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf http://eprints.utem.edu.my/id/eprint/20941/2/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf
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id	my-utem-ep.20941
record_format	uketd_dc
spelling	my-utem-ep.209412022-11-07T11:20:02Z Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS 2016 Heng, Soo Ann T Technology (General) TP Chemical technology This master project proposed is to look insight into semiconductor field related project which has the topic of IMPROVEMENT OF MOLDING PROCESS SCHEDULED DOWNTIME FOR INTEGRATED CIRCUITS PACKAGE DPAK STS where common name of Dpak will be power product T0252 series. First and foremost, the topic involved in this project will be the introduction which includes problem statement that contributes to the start of project where the need of reducing schedule downtime in molding process is included. It is then followed by literature review where work of others are reviewed so that the no repetition on work done is available and to study on the method of implementation done by others in the similar field. This project will also discuss about the method used in the detail analysis in the project so that waste on downtime can be achieved. Upon result of analysis is available, various improvement actions will be suggested accordingly. By implementation of the improvement actions in the production, the result of the implementation will be monitored according to the implementation date. The objective of performing improvement in schedule downtime reduction for Molding process of integrated circuits package DPAK STS in Infineon Technologies (M) Sdn Bhd will be monitored in the result & discussion section. 2016 Thesis http://eprints.utem.edu.my/id/eprint/20941/ http://eprints.utem.edu.my/id/eprint/20941/1/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf text en public http://eprints.utem.edu.my/id/eprint/20941/2/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf text en validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=104922 mphil masters Universiti Teknikal Malaysia Melaka Faculty of Manufacturing Engineering Kamat, Seri Rahayu
institution	Universiti Teknikal Malaysia Melaka
collection	UTeM Repository
language	English English
advisor	Kamat, Seri Rahayu
topic	T Technology (General) TP Chemical technology
spellingShingle	T Technology (General) TP Chemical technology Heng, Soo Ann Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
description	This master project proposed is to look insight into semiconductor field related project which has the topic of IMPROVEMENT OF MOLDING PROCESS SCHEDULED DOWNTIME FOR INTEGRATED CIRCUITS PACKAGE DPAK STS where common name of Dpak will be power product T0252 series. First and foremost, the topic involved in this project will be the introduction which includes problem statement that contributes to the start of project where the need of reducing schedule downtime in molding process is included. It is then followed by literature review where work of others are reviewed so that the no repetition on work done is available and to study on the method of implementation done by others in the similar field. This project will also discuss about the method used in the detail analysis in the project so that waste on downtime can be achieved. Upon result of analysis is available, various improvement actions will be suggested accordingly. By implementation of the improvement actions in the production, the result of the implementation will be monitored according to the implementation date. The objective of performing improvement in schedule downtime reduction for Molding process of integrated circuits package DPAK STS in Infineon Technologies (M) Sdn Bhd will be monitored in the result & discussion section.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Heng, Soo Ann
author_facet	Heng, Soo Ann
author_sort	Heng, Soo Ann
title	Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
title_short	Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
title_full	Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
title_fullStr	Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
title_full_unstemmed	Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS
title_sort	improvement of molding process scheduled downtime reduction for integrated circuits package dpak sts
granting_institution	Universiti Teknikal Malaysia Melaka
granting_department	Faculty of Manufacturing Engineering
publishDate	2016
url	http://eprints.utem.edu.my/id/eprint/20941/1/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf http://eprints.utem.edu.my/id/eprint/20941/2/Improvement%20of%20molding%20process%20Scheduled%20Downtime%20reduction%20for%20integrated%20circuits%20package%20DPAK%20STS.pdf
_version_	1776103112097923072

Improvement of molding process scheduled downtime reduction for integrated circuits package DPAK STS

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