Improvement of change glue schedule down time at lid attachment process for semiconductor devices

This research report presents the work done on the improvement of change glue schedule down time at lid attachment process for semiconductor devices. Lid attachment is the end of line process for Plastic Dual Small Outline Flat (PDSOF) package which is one of the semiconductor devices. The process...

Full description

Saved in:

Bibliographic Details
Main Author:	Abd Rahman, Rozeana
Format:	Thesis
Language:	English English
Published:	2017
Subjects:	T Technology (General) TS Manufactures
Online Access:	http://eprints.utem.edu.my/id/eprint/23785/1/Improvement%20Of%20Change%20Glue%20Schedule%20Down%20Time%20At%20Lid%20Attachment%20Process%20For%20Semiconductor%20Devices%20-%20Rozeana%20Abd%20Rahman%20-%2024%20Pages.pdf http://eprints.utem.edu.my/id/eprint/23785/2/Improvement%20of%20change%20glue%20schedule%20down%20time%20at%20lid%20attachment%20process%20for%20semiconductor%20devices.pdf
Tags:	Add Tag No Tags, Be the first to tag this record!

id	my-utem-ep.23785
record_format	uketd_dc
spelling	my-utem-ep.237852022-06-13T10:03:53Z Improvement of change glue schedule down time at lid attachment process for semiconductor devices 2017 Abd Rahman, Rozeana T Technology (General) TS Manufactures This research report presents the work done on the improvement of change glue schedule down time at lid attachment process for semiconductor devices. Lid attachment is the end of line process for Plastic Dual Small Outline Flat (PDSOF) package which is one of the semiconductor devices. The process is started with pick and places the lid onto the package, then proceeds to glue dispensing with dosage on four corners of the lids to completely seal the package by using capillary effect. There is a change of glue activity in this process which is counted under schedule down time. Based on the Overall Equipment Effectiveness (OEE), it was found that the change of glue activity give impact on the machine performance. The increasing of change glue time will result in the production did not achieve the target productivity. In this research, the hidden losses were defined on the equipment setup which is changed of glue in the lid attachment process. There is plan to increase the amount of glue lid attach to reduce the schedule down time in order to improve overall equipment effectiveness toward achieving good productivity. The study for glue pot life is required since increasing the amount of glue will extend the glue pot life and it is suspected will increase the glue viscosity. In general, all the project objective are managed to be achieved using the developed research methodology. For future work, this research should be enhance further to achieve better result and to make use of the increasing glue amount and pot life extended time enhancement in other perspective field and also to carry out further study to improve on the whitish on lid surface. UTeM 2017 Thesis http://eprints.utem.edu.my/id/eprint/23785/ http://eprints.utem.edu.my/id/eprint/23785/1/Improvement%20Of%20Change%20Glue%20Schedule%20Down%20Time%20At%20Lid%20Attachment%20Process%20For%20Semiconductor%20Devices%20-%20Rozeana%20Abd%20Rahman%20-%2024%20Pages.pdf text en public http://eprints.utem.edu.my/id/eprint/23785/2/Improvement%20of%20change%20glue%20schedule%20down%20time%20at%20lid%20attachment%20process%20for%20semiconductor%20devices.pdf text en validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109159 mphil masters Universiti Teknikal Malaysia Melaka Faculty Of Manufacturing Engineering Bali Mohamad, Bashir Mohamad
institution	Universiti Teknikal Malaysia Melaka
collection	UTeM Repository
language	English English
advisor	Bali Mohamad, Bashir Mohamad
topic	T Technology (General) TS Manufactures
spellingShingle	T Technology (General) TS Manufactures Abd Rahman, Rozeana Improvement of change glue schedule down time at lid attachment process for semiconductor devices
description	This research report presents the work done on the improvement of change glue schedule down time at lid attachment process for semiconductor devices. Lid attachment is the end of line process for Plastic Dual Small Outline Flat (PDSOF) package which is one of the semiconductor devices. The process is started with pick and places the lid onto the package, then proceeds to glue dispensing with dosage on four corners of the lids to completely seal the package by using capillary effect. There is a change of glue activity in this process which is counted under schedule down time. Based on the Overall Equipment Effectiveness (OEE), it was found that the change of glue activity give impact on the machine performance. The increasing of change glue time will result in the production did not achieve the target productivity. In this research, the hidden losses were defined on the equipment setup which is changed of glue in the lid attachment process. There is plan to increase the amount of glue lid attach to reduce the schedule down time in order to improve overall equipment effectiveness toward achieving good productivity. The study for glue pot life is required since increasing the amount of glue will extend the glue pot life and it is suspected will increase the glue viscosity. In general, all the project objective are managed to be achieved using the developed research methodology. For future work, this research should be enhance further to achieve better result and to make use of the increasing glue amount and pot life extended time enhancement in other perspective field and also to carry out further study to improve on the whitish on lid surface.
format	Thesis
qualification_name	Master of Philosophy (M.Phil.)
qualification_level	Master's degree
author	Abd Rahman, Rozeana
author_facet	Abd Rahman, Rozeana
author_sort	Abd Rahman, Rozeana
title	Improvement of change glue schedule down time at lid attachment process for semiconductor devices
title_short	Improvement of change glue schedule down time at lid attachment process for semiconductor devices
title_full	Improvement of change glue schedule down time at lid attachment process for semiconductor devices
title_fullStr	Improvement of change glue schedule down time at lid attachment process for semiconductor devices
title_full_unstemmed	Improvement of change glue schedule down time at lid attachment process for semiconductor devices
title_sort	improvement of change glue schedule down time at lid attachment process for semiconductor devices
granting_institution	Universiti Teknikal Malaysia Melaka
granting_department	Faculty Of Manufacturing Engineering
publishDate	2017
url	http://eprints.utem.edu.my/id/eprint/23785/1/Improvement%20Of%20Change%20Glue%20Schedule%20Down%20Time%20At%20Lid%20Attachment%20Process%20For%20Semiconductor%20Devices%20-%20Rozeana%20Abd%20Rahman%20-%2024%20Pages.pdf http://eprints.utem.edu.my/id/eprint/23785/2/Improvement%20of%20change%20glue%20schedule%20down%20time%20at%20lid%20attachment%20process%20for%20semiconductor%20devices.pdf
_version_	1747834055049609216

Improvement of change glue schedule down time at lid attachment process for semiconductor devices

Similar Items