Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application

Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application

This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if...

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Main Author: Jamaluddin, Nurezzaty
Format: Thesis
Language:English
English
Published: 2020
Subjects:
T Technology (General)
TJ Mechanical engineering and machinery
Online Access:http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
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id my-utem-ep.25572
record_format uketd_dc
institution Universiti Teknikal Malaysia Melaka
collection UTeM Repository
language English
English
advisor Minhat, Mohamad
topic T Technology (General)
TJ Mechanical engineering and machinery
spellingShingle T Technology (General)
TJ Mechanical engineering and machinery
Jamaluddin, Nurezzaty
Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
description This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if backside chipping increases, sidewall chipping will increases as well. In order to reduce backside chipping, investigation had found three potential area that may improve backside and sidewall chipping with parameter optimization. Two main element was identified on this problem which are material and machine. Z2 blade type is identify as one of contribution of this issue and machine parameter for chuck table feedspeed and cutting ratio are the other variance that causing higher backside chipping. By using six sigma tools (DMAIC) this project resulted improve yield performance with new type ofZ2 blade with optimize parameter of table feedspeed and cutting depth ratio.
format Thesis
qualification_name Master of Philosophy (M.Phil.)
qualification_level Master's degree
author Jamaluddin, Nurezzaty
author_facet Jamaluddin, Nurezzaty
author_sort Jamaluddin, Nurezzaty
title Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
title_short Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
title_full Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
title_fullStr Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
title_full_unstemmed Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application
title_sort backside chipping improvement of non-backcoated bare die device for mobile application
granting_institution Universiti Teknikal Malaysia Melaka
granting_department Faculty of Manufacturing Engineering
publishDate 2020
url http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf
_version_ 1747834142008016896
spelling my-utem-ep.255722022-01-06T14:05:27Z Backside Chipping Improvement Of Non-Backcoated Bare Die Device For Mobile Application 2020 Jamaluddin, Nurezzaty T Technology (General) TJ Mechanical engineering and machinery This project is backside chipping improvement of non- backcoated bare die device for mobile application due to low yield performance. Analysis of this project will be use JMP software to analyze the prediction result and final result in order to improve backside chipping. Based on data analysis, if backside chipping increases, sidewall chipping will increases as well. In order to reduce backside chipping, investigation had found three potential area that may improve backside and sidewall chipping with parameter optimization. Two main element was identified on this problem which are material and machine. Z2 blade type is identify as one of contribution of this issue and machine parameter for chuck table feedspeed and cutting ratio are the other variance that causing higher backside chipping. By using six sigma tools (DMAIC) this project resulted improve yield performance with new type ofZ2 blade with optimize parameter of table feedspeed and cutting depth ratio. 2020 Thesis http://eprints.utem.edu.my/id/eprint/25572/ http://eprints.utem.edu.my/id/eprint/25572/1/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf text en 2025-08-23 validuser http://eprints.utem.edu.my/id/eprint/25572/2/Backside%20Chipping%20Improvement%20Of%20Non-Backcoated%20Bare%20Die%20Device%20For%20Mobile%20Application.pdf text en 2025-08-23 validuser https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119199 mphil masters Universiti Teknikal Malaysia Melaka Faculty of Manufacturing Engineering Minhat, Mohamad 1. Abdullah, S Yusof, S. 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Process Challenges in Low-k Wafer Dicing. IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium, 2003. IEMT 2003., pp. 401-407. 7. Hoh Huey Jiun,I. Ahmad,A. Jalar,G. Omar, 2006. Alternative double pass dicing method for thin wafer laminated with die attach film. 2004 IEEE International Conference on Semiconductor Electronics, pp. 636-641. 8. Huapan Xiao,cHairong Wang, Na Yu,Rongguang Liang, ZheTong, ZhiChen, JiuhongWang, 2019. Evaluation of fixed abrasive diamond wire sawing induced subsurface damage of solar silicon wafers. Journal of Materials Processing Technology, Volume 273, pp. 1-10. 9. Jau-Wen Lin, Ming-Hon Cheng, 2014. Investigation of chipping and wear of silicon wafer dicing. Journal of Manufacturing Process, 16(3), pp. 1-6. 10. KF, L., 2011. Alternative Dicing Die Attach Film Method for High Volume Small Dice Application. 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), pp. 1-6. 11. Koh Wen Shi,K. Y. Yow,Rachel Khoo, 2012. Developments of blade dressing technique using SiC board for C90 low-k wafer sawing. 2011 IEEE 13th Electronics Packaging Technology Conference, pp. 1-7. 12. Lu, Chun Yu, Hao, 2011. Growth Mechanism of Cathode IMC Layer in Solder Bump Joints.Transaction of JWR1, pp. 25-26. 13. Michael RajMarks,Kuan YewCheong,ZainuriahHassan, 2019. Fracture strength and microstructural study of ultrathin Si die with Cu backside layer diced with picosecond laser. Materials Science and Engineering, Volume 759, pp. 785-796. 14. Peh Kok Hua,Low Chen Chuan,See Beng Keh, 2011. Effect of type of foil and blade type to backside chipping in wafer level packages. 2008 International Symposium ON Semiconductor Manufacturing (ISSM), 1(1), pp. 1-3. 15. S. Budhe, A. Ghumatkar,N. Birajdar,M. D. Banea, 2015. Effect of surface roughness using different adherend materials on the adhesive bond strength. Springer International Publishing, pp. 1-10. 16. Shi Koh Wen,Kar, Yap Boou, Misran Halina, Yun Yow Kai, Yew, Lo Wei, Hui, Tau Cai, 2014. Optimization of Wafer Singulation Process on Copper/Low-k Materials for Semiconductor Device Assembly. Austalian Journal of Basic and Applied Science, 22(8), pp. 6-11. 17. Technology, E., 2019. Cure Matters Determining the Proper Cure Schedule. [Online] Available at: http://www.epotek.com/site/Files/brochures/pdfs/Cure Matters Final.pdf 18. Tech, P., 2019. PacTech. [Online] Available at: https://www.pactech.com/wlp-services/wafer-sawing-dicing/ [Accessed 30 December 2019], 19. Te-JenSu,Yi-FengChen,Jui-ChuanChen,Chien-LiangChiu, 2018. An artificial neural network approach for wafer dicing saw quality prediction. Microelectronics Reliability, 91(2), pp. 257- 20. W.Shualdi, I.Ahmad, G. Omar and A.Isnin, 2006. Effect of Thermal Aging on The IMC Layer between SnAgSb Solder ad Cu Substrate. Malaysia: Solid State Science and Technology. 21. Xhelin, Z., 2001. DESIGN OF AN AUTOMATED INKLESS WAFERMAP SYSTEM, United State: Texas Tech University.. 22. XinyingLi,YufeiGao,PeiqiGe,LeiZhang,WenboBia, 2019. The effect of cut depth and distribution for abrasives on wafer surface morphology in diamond wire sawing of PV polycrystalline silicon. Materials Science in Semiconductor Processing, Volume 91, pp. 3l6-326. 23. Y. C. Jang, S. Y. Park, H. D. Kim, Y. C. Ko, K. W. Koo, M. R. Choi, H. G. Kim, N. K. Cho, I.,T. Kang, J. H. Yee and S. H. Limb, 2014. Study of Intermetallic Compound Growth ad Failure Mechanisms in Long Term Reliability of Silver Bonding Wire. IEEE 16th Electronic Packaging Technology Conference, pp. 1-10. 24. Y.H. Chiew, J.Y Liong, F.F Tan, 2018. Mechanical Dicing Challenges and Development on 50um Saw Street with Wafer Backside Coating (WBC). 2018 IEEE 38th International Electronics Manufacturing Technology Conference (IEMT), 1(1), pp. 1-8. 25. Y.-Y. Wanga, C.-J. L. O., 2005. Influence of substrate roughness on the bonding mechanisms of high velocity oxy-fuel sprayed coatings. Sciencedirect, pp. 1-7.

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