Thermosonic micro-interconnections: Interfacial Cu-Al intermetallics compound growth studies based on stress modelling

Thermosonic micro-interconnections: Interfacial Cu-Al intermetallics compound growth studies based on stress modelling

One of the most common wire bonding technology involving copper (Cu) wire interconnections is the thermosonic bonding technique. Still, the volumetric changes of intermetallic compounds (IMCs) formed at the bonding interface of Cu wire on Al bond pads induce voids formation in the Cu-Al IMC layer. T...

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書目詳細資料
主要作者:	Sharir, Shariza
格式:	Thesis
語言:	English English
出版:	2024
在線閱讀:	http://eprints.utem.edu.my/id/eprint/28287/1/Thermosonic%20micro-interconnections-%20Interfacial%20Cu-Al%20intermetallics%20compound%20growth%20studies%20based%20on%20stress%20modelling.pdf http://eprints.utem.edu.my/id/eprint/28287/2/Thermosonic%20micro-interconnections-%20Interfacial%20Cu-Al%20intermetallics%20compound%20growth%20studies%20based%20on%20stress%20modelling.pdf
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