Variability reduction in stencil printing of solder paste for surface mount technology

Competition in stencil printing to produce excellence in the finished product is intense. Faults in the printing process are a major source of board failure. Studies have shown that over 63% of defects identified after reDow originated from the solder paste printing ( A. Lotfi ,1998 ) . Howeve...

Full description

Saved in:
Bibliographic Details
Main Author: Ibrahim, Mustaffa
Format: Thesis
Language:English
Published: 1998
Subjects:
Online Access:http://eprints.uthm.edu.my/7697/1/24p%20MUSTAFFA%20IBRAHIM.pdf
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items