Interfacial reactions during soldering of Sn-Ag-Cu lead free solders on immersion silver and electroless nickel/ immersion gold surface finishes

In the on-going trend towards miniaturization in the electronics packaging industry, the increasing popularity of ultra fine line technologies has brought into question the physical aspects of pad topography and metallization. As the solder joints shrink in size, the thickness of the pad metallizati...

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主要作者: Idris, Siti Rabiatull Aisha
格式: Thesis
语言:English
出版: 2008
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在线阅读:http://eprints.utm.my/id/eprint/10069/1/SitiRabiatullAishaMFKM2008.pdf
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