Interfacial reactions during soldering of lead-free solders on copper and nickel substrates

Saved in:
Bibliographic Details
Main Author: Idris, Siti Rabiatull Aisha
Format: Thesis
Published: 2012
Subjects:
Tags: Add Tag
No Tags, Be the first to tag this record!
id my-utm-ep.32195
record_format uketd_dc
spelling my-utm-ep.321952013-06-12T07:54:32Z Interfacial reactions during soldering of lead-free solders on copper and nickel substrates 2012-00 Idris, Siti Rabiatull Aisha Unspecified 2012-00 Thesis http://eprints.utm.my/id/eprint/32195/ phd doctoral Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution Universiti Teknologi Malaysia
collection UTM Institutional Repository
topic Unspecified
spellingShingle Unspecified
Idris, Siti Rabiatull Aisha
Interfacial reactions during soldering of lead-free solders on copper and nickel substrates
description
format Thesis
qualification_name Doctor of Philosophy (PhD.)
qualification_level Doctorate
author Idris, Siti Rabiatull Aisha
author_facet Idris, Siti Rabiatull Aisha
author_sort Idris, Siti Rabiatull Aisha
title Interfacial reactions during soldering of lead-free solders on copper and nickel substrates
title_short Interfacial reactions during soldering of lead-free solders on copper and nickel substrates
title_full Interfacial reactions during soldering of lead-free solders on copper and nickel substrates
title_fullStr Interfacial reactions during soldering of lead-free solders on copper and nickel substrates
title_full_unstemmed Interfacial reactions during soldering of lead-free solders on copper and nickel substrates
title_sort interfacial reactions during soldering of lead-free solders on copper and nickel substrates
granting_institution Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department Faculty of Mechanical Engineering
publishDate 2012
_version_ 1747815944533573632