Mechanism-based reliability model for electronic packages

Mechanism-based reliability model is different from the conventional reliability model. It is generated based on a specific failure. The failure mechanism is studied in detail to obtain a model that incorporates all significant stressing variables. For fatigue driven failure, Coffin-Manson equation...

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Main Author:	Ng, Chee Weng
Format:	Thesis
Language:	English
Published:	2005
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://eprints.utm.my/id/eprint/4369/1/NgCheeWengMFKM2005.pdf
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id	my-utm-ep.4369
record_format	uketd_dc
spelling	my-utm-ep.43692018-01-28T02:56:34Z Mechanism-based reliability model for electronic packages 2005-07 Ng, Chee Weng TJ Mechanical engineering and machinery Mechanism-based reliability model is different from the conventional reliability model. It is generated based on a specific failure. The failure mechanism is studied in detail to obtain a model that incorporates all significant stressing variables. For fatigue driven failure, Coffin-Manson equation is the typical and most favourable model due to its simplicity. However, important variables in thermal cycling which are dwell time and ramp rate are not considered in this model. Studies were carried out to investigate the effects of dwell time and ramp rate on the reliability of electronic packages based on Bump Limiting Metallurgy (BLM) separation failure criterion. The experimental results showed that dwell time and ramp rate significantly affected the reliability performance of the BLM structure in the electronic package. The effect of ramp rate was converted into a newly introduced variable, called effective dwell time, (tdwell)eff. Earlier failure of the BLM was observed with the increase of the (tdwell)eff and temperature change, âˆ†T. Silicon die side wall delamination (SWD) failure was studied to check the applicability of the same approach used in BLM reliability analysis to other fatigue driven failure in electronic package. The studies showed that the same approach was applicable in reliability modelling based on SWD failure. The increase of âˆ†T, dwell time and ramp rate could accelerate SWD failure. 2005-07 Thesis http://eprints.utm.my/id/eprint/4369/ http://eprints.utm.my/id/eprint/4369/1/NgCheeWengMFKM2005.pdf application/pdf en public masters Universiti Teknologi Malaysia, Faculty of Mechanical Engineering Faculty of Mechanical Engineering
institution	Universiti Teknologi Malaysia
collection	UTM Institutional Repository
language	English
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Ng, Chee Weng Mechanism-based reliability model for electronic packages
description	Mechanism-based reliability model is different from the conventional reliability model. It is generated based on a specific failure. The failure mechanism is studied in detail to obtain a model that incorporates all significant stressing variables. For fatigue driven failure, Coffin-Manson equation is the typical and most favourable model due to its simplicity. However, important variables in thermal cycling which are dwell time and ramp rate are not considered in this model. Studies were carried out to investigate the effects of dwell time and ramp rate on the reliability of electronic packages based on Bump Limiting Metallurgy (BLM) separation failure criterion. The experimental results showed that dwell time and ramp rate significantly affected the reliability performance of the BLM structure in the electronic package. The effect of ramp rate was converted into a newly introduced variable, called effective dwell time, (tdwell)eff. Earlier failure of the BLM was observed with the increase of the (tdwell)eff and temperature change, âˆ†T. Silicon die side wall delamination (SWD) failure was studied to check the applicability of the same approach used in BLM reliability analysis to other fatigue driven failure in electronic package. The studies showed that the same approach was applicable in reliability modelling based on SWD failure. The increase of âˆ†T, dwell time and ramp rate could accelerate SWD failure.
format	Thesis
qualification_level	Master's degree
author	Ng, Chee Weng
author_facet	Ng, Chee Weng
author_sort	Ng, Chee Weng
title	Mechanism-based reliability model for electronic packages
title_short	Mechanism-based reliability model for electronic packages
title_full	Mechanism-based reliability model for electronic packages
title_fullStr	Mechanism-based reliability model for electronic packages
title_full_unstemmed	Mechanism-based reliability model for electronic packages
title_sort	mechanism-based reliability model for electronic packages
granting_institution	Universiti Teknologi Malaysia, Faculty of Mechanical Engineering
granting_department	Faculty of Mechanical Engineering
publishDate	2005
url	http://eprints.utm.my/id/eprint/4369/1/NgCheeWengMFKM2005.pdf
_version_	1747814520431050752

Mechanism-based reliability model for electronic packages

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