Nanoscale microstructural characterization of aluminum and copper bilayer thin films deposited on silicon substrate using magnetron sputtering technique
Aluminum and copper (Al-Cu) bilayer thin films are commonly used as conductors in electronic applications. Unfortunately, the effect of thermal aging on the interfaces of Al-Cu bilayer thin films have led to the formation of intermetallic compounds (IMCs) which eventually degrades the materials. The...
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Main Author: | Abdul Halim, Zulhelmi Alif |
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Format: | Thesis |
Language: | English |
Published: |
2014
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Subjects: | |
Online Access: | http://eprints.utm.my/id/eprint/50821/25/ZulhelmiAlifAbdulHalimMFKM2014.pdf |
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