Heat transfer characterization of air circulation inside a system of stackable electronic devices
The purpose of this study is to investigate the ability of forced circulated air inside a system of stackable electronic devices in transferring heat generated from four identical Intel J1900 10W computer processor unit (CPU). Each CPU was isolated from each other by locating it inside four separate...
Saved in:
主要作者: | Md. Ali, Muhammad Nasir |
---|---|
格式: | Thesis |
语言: | English |
出版: |
2017
|
主题: | |
在线阅读: | http://eprints.utm.my/id/eprint/78864/1/MuhammadNasirMdMFKM2017.pdf |
标签: |
添加标签
没有标签, 成为第一个标记此记录!
|
相似书籍
-
Analysis of characteristic heat pipe as an efficient cooling heat transfer device
由: Alfan, Norman Hafizi
出版: (2013) -
Reducing indoor air contaminants inside a campus bus passenger compartment
由: Ahmad Shafie, Noor Emilia
出版: (2016) -
Experimental And Numerical Studies Of Transient Heat Transfer In Electronics Packaging
由: Ong, Kean Aik
出版: (2017) -
Heat transfer analysis in multi-configuration microchannel heat sink
由: Ghani, Ihsan Ali
出版: (2017) -
Numerical simulations on the effects of using ventilation fan on conditions of air inside a car passenger compartment
由: Sabri, Intan Sabariah
出版: (2014)